What is the classification of a wafer slicing saw, i.e., a machine tool that slices wafers from a boule of monocrystalline silicon semiconductor material? Documentation has been supplied establishing that this particular model is of a kind used solely or principally for the manufacture of semiconductor wafers.
A. 8456.20.5000
B. 8464.10.0100
C. 8477.10.4000
D. 8479.89.9899
E. 8486.10.0000
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The Answer is: E
Citation: HTSUS 8486.10.0000; Chapter 84, Note 2 and Note 9(D); Section XVI, Statistical Note 1(a)(ii)(B)
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